Dipin Jain is currently the Sr. Product Manager, for Powerand Intelligent Hardware Products in the Data Center Business Unit at Panduit Corp. In this role Dipin is a member of the product management team for the intelligent power, environmental & rack access control hardware and their associated accessories. Dipin joined Panduit in 2015 and has been active in the release of the new SmartZone Generation 5 Platform of products to the marketplace. Dipin has over 15 years of experience in the Datacenter, Industrial Automation and Aerospace industries. Dipin has held various technical, business, sales operations, product management, and engineering roles at major companies such as: Boeing, Seattle City Light, Northrop Grumman, Schneider Electric and Panduit. Over Dipin’s career he has been awarded a solo patent by the United States Patent and Trademark Office, for developing a High-Power Solid-State Relay with Internal Heat sink. Dipin received his Bachelor of Science in Electrical Engineering from Seattle University (Seattle, WA), is a trained Black Belt in Six Sigma (Dallas, TX) and holds an MBA from Loyola University (Chicago, IL